Silicon is broadly used in semiconductor and optics. In semiconductor, Si is usually grown by CZ and FZ. Generally, the resistivity of Si grown by CZ(< 10 ohm/cm) is lower than that by FZ(>10 ohm/cm). In infrared optics, we commonly use FZ silicon which is much pure for the purpose of better transmittance. The transmittance is generally between 3-8 um. With AR ...

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    Infrared silicon window

    ● General Specification
    Substrate : silicon
    Dia: 1.5-450 mm
    Thickness: 1-50 mm/custom
    ● Surface specification
    Scratch/Dig: 40/20
    Flatness: 1/2 lambda@633 um
    Cylindrical Surface: Fine Grinding/ Felt Polish
    Parallelism : <3 arc minutes

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    CO2 laser mirror

    ● General Specification
    Substrate : silicon
    Dia: 1.5-450 mm/custom
    Thickness: 1-50 mm/custom
    ● Surface specification
    Scratch/Dig: 40/20
    Flatness: 1/2 lambda@633 um
    Cylindrical Surface: Fine Grinding/ Felt Polish
    Parallelism : <3 arc minutes

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    Prime Grade silicon wafer

    ● General Specification
    Dia: 2-6 inch
    Thickness: Standard/Custom
    Type: N/P Type
    Orientation: 100 / 111
    Resistivity: Custom
    Surface: Single side polished / Double side polished
    TTV: < 5 um
    Bow/Warp: <30 um

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    Silicon Sputtering Target

    ● General Specification
    Substrate : polycrystalline silicon
    Size: 1.5-150 mm
    Thickness: 1-50 mm/custom
    ● Surface specification
    Surface: Fine grinding/Acid
    Irregularity: 2 fringes
    Cylindrical Surface: Fine Grinding/ Felt Polish
    Parallelism : <3 arc minutes

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  • 1